by GNP
CMP POLI 610

CMP


CMP POLI 610


CMP equipment for hard and inert wafers, high down-force, up to 2 heads, and up to...

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by GNP
CMP POLI 762

CMP


CMP POLI 762


Intelligent CMP equipment designed for high versatility for 12″ (300 mm) wafers.

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by GNP
Front view of GnP POLI-400L a CMP system.

CMP


R&D CMP POLI 400


Manual loading, automated single-spindle, single-table 150 mm CMP equipment.  

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by GNP

CMP


R&D CMP POLI 500


Manual loading, automated single-spindle, single-table 200 mm CMP equipment.

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by AXUS (Italy and UK only)
Capstone CS200-ma (Standalone Configuration) CMP system of Axus Technology, side view

CMP


Capstone® CS200


High-throughput dry-in, dry-out (DIDO) CMP tool for 100–200 mm wafers.

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by AXUS (Italy and UK only)
Crystal Carrier Upgrade of Axus Technology

CMP


Crystal Carrier upgrade


Carrier upgrade with Axus advanced 4-zone membrane carrier for ultra-thin or fragile wafers.

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